Open search

Qseven module

Compact form factor for IoT systems

VIA Technologies has launched the QSM-8Q60 Qseven module powered by a 1 GHz Freescale i.MX 6 Dual Lite Cortex-A9 SoC. The module includes two CAN ports.

The Qseven module measures 70 mm x 70 mm (Photo: VIA)

COMBINING MULTIMEDIA PERFORMANCE with an array of I/O features in a low power, compact package, the module is suitable for a range of applications such as industrial automation, transportation, medical, and infotainment. The module measures 70 mm x 70 mm and is compliant with the Qseven Rev. 2.0 embedded form factor standard adopted by the Standardization Group for Embedded Technologies. According to the company, this modular design approach allows for short time-to-market, application-specific customization, high stability, and long life cycles for customers developing enterprise-grade IoT and embedded systems.

In addition to its Cortex-A9 SoC, the module has an on-board Micro SD card slot, 4 GiB eMMC Flash memory, and 2 GiB DDR3-10666 SDRAM. To provide system design flexibility, the module also offers an array of I/O and display expansion options, including two CAN ports, four USB 2.0 ports, one HDMI port, one dual-channel 18/24-bit LVDS panel, two COM ports, Gigabit Ethernet, and PCIe x1. Support for an operating temperature of -20 °C to 70 °C ensures reliability in even harsh operating environments.

“The explosive growth of the Internet of Things is leading to growing demand for highly-customized systems targeted at a plethora of commercial IoT applications,” said Richard Brown, Vice-President of International Marketing at VIA Technologies. “With its modular low power design and comprehensive BSP and software support services, the VIA QSM-8Q60 addresses this need by minimizing development costs and accelerating the time-to-market.”

The module features a Linux BSP, which includes the kernel and bootloader source codes. Other features include a tool chain to help make adjustments to the kernel and to support the VIA QSMBD2 carrier board I/O and other hardware features. A set of software customization services that speed up time to market and minimize development costs is also available.