Open search
Advertisement

Processor series

Starter kit for NXP designs

Congatec presented the Smarc 2.0 starter kit for NXP i.MX 8 designs. It features a CAN interface.

The Smarc 2.0 starter kit from Congatec simplifies the development of NXP i.MX 8 based applications (Source: Congatec)

The starter kit is suitable for the NXP i.MX8 Quadmax processor series. Developers of vision-based AI (artificial intelligence) applications, in particular, benefit from the natively supported integrated MIPI (mobile industry processor interface alliance) interfaces and optional pre-configured software support for artificial intelligence.

The starter kit integrates conga-SMX8 computer modules with either the low-power NXP i.MX 8X or the high-end NXP i.MX8 (Quadmax) series, as well as a conga-seval evaluation carrier board, which offers access to all interfaces and functions for Smarc 2.0 based NXP i.MX 8 designs. The evaluation carrier supports a set of interfaces including CAN. Displays can be connected via dual channel LVDS, eDP, DP and 2x MIPI-DSI, and additional storage media via an SD/MMC socket and 1x Sata 6G. Digital and analog audio I/Os for I2S and HDA complete the interface offer.

"Developers of highly integrated IIoT, industrial, and embedded vision applications can reach the next technology level very quickly and easily with the new NXP i.MX8 based Smarc 2.0 modules, because they can immediately integrate a credit card sized off-the-shelf module into their applications with minimum space requirements. The starter kit is a key complement to our comprehensive i.MX 8 ecosystem of products and services. It enables the rapid evaluation of this brand-new processor architecture, which will open up many new application fields for us in the real-time industrial area as well as in vision-based AI sectors," explained Martin Danzer, Director Product Management at Congatec.

Services offered by the Technical Solution Center for the Smarc 2.0 and Qseven modules with NXP i.MX 8X processors range from high assurance booting (HAB) implementation, bootloader, and OS image authentication through private and public key cryptography and customer-specific BSP adaptation to long-term software maintenance for Linux and Android. The offering further includes selection of suitable carrier board components and design reviews as well as high-speed signal compliance tests, thermal simulations, MTBF calculations, and debugging services for customer-specific solutions.

The kit also includes an ATX power supply, the conga-ACA2 MIPI CSI-2 dual camera module, WLAN antenna, LVDS adapter, SATA, USB cable and a cooling solution for the module. On software side, a qualified bootloader package and board support packages for Linux, Yocto, and Android are available through the Congatec Git server.

cw



Publish date
2019-07-17
Company

Congatec

Breadcrumb
Advertisement
CAST