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Interface module

Ready-to-solder

Hilscher’s (Germany) Netrapid stamp-sized module is a network controller that delivers CANopen and Devicenet integration. It is soldered directly onto a printed circuit board.

The module measures 32 mm x 32 mm x 4 mm (Photo: Hilscher)

BUILT ON THE COMPANY'S NETX CHIP, the module takes advantage of their protocol stacks, development kits, and support services. According to the provider, development times can be reduced from months to weeks. Additionally the module minimizes the need for in-house integration expertise. The only hardware development required is connecting the LEDs and address switch, and connection to the automation device via the dual-port memory or the SPI port. Software development involves programming the dual-ported memory or the SPI connections. The evaluation kit includes all documentation together with the slave protocol stack as loadable firmware, a linkable object module or as source code.



Publish date
2014-06-18
Company

Hilscher

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